TG-A2200 – Ultra Soft Thermal Pad

Thermal Conductivity: 2.2
Size: 310mmX150mm

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

For overseas orders, please send in enquiry form.

SKU: TG-A2200 Categories: All Products, Catalogue, Thermal Interface, Thermal Pad/Gap Filler

Features

Features

Thickness
Thermal Conductivity
Hardness: 30-60 Shore 00, Soft and highly compressibility
Low contact thermal impedance
Silicon and non-silicon base material
UL V0 rated
Optional fiber glass reinforcement layer for better handling during assembly process
Natural tack on surfaces or laminate with adhesive tape upon customer requests
Soft and highly compressible
Easy for die-cut