Thermal Conductive Epoxy Adhesive
- Thermal Conductive Epoxy
- Good thermal conductivity (Epoxy Base)
- Room temperature or heating curing (35hrs at 25℃/1.5 hrs at 80℃) A:B=13:1
- High stability
- Water proof
- Applications include: Electronic components: IC, CPU, MOS, LED、M/B、P/S, Heat Sink, LCD-TV, Notebook PC, PC, Telecom Device, Wireless HuB, DDR II Module, DVD Applications, Hand-set applications…etc
For overseas orders, please send in enquiry form.
Features
