TG6060 – Thermal Putty

TG6060 is a thermal putty its 6.3W/MK thermal conductivity also contains silicone cement. This thermal pad is a relatively low thermal resistance due to its mud-like texture. Suitable for products with uneven heat sources.

A small amount of cement can fill the gaps on the surface of the heat source to achieve excellent thermal conductivity. Compared with thermal paste, it is more convenient for construction and it has the characteristics of non-overflow and non-hardening. It is characterized by low thermal resistance, softness, strong plasticity, and environmental protection.