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TG-A20KX – Thermal Pad

Thermal Conductivity: 2

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

For overseas orders, please send in enquiry form.

SKU: TG-A20KX Categories: All Products, Catalogue, Thermal Interface, Thermal Pad/Gap Filler

Description
Features

Description

TG-A20KX – is a new product developed by T-Global in the year 2020. It is a thermally conductive silicone film with 2W/MK thermal conductivity and the thermal conductivity is hard to deform, it has a good structure and good thermal conductivity, and double-mask self-adhesiveness. It effectively reduces the thermal resistance between the surface of the heat source and the contact surface of the heat sink

Features

Thickness 0-8mm
Thermal Conductivity: 2.2 ~ 25W/m.k
Hardness: 30-60 Shore 00, Soft and highly compressibility
Low contact thermal impedance
Silicon and non-silicon base material
UL V0 rated
Optional fiber glass reinforcement layer for better handling during assembly process
Natural tack on surfaces or laminate with adhesive tape upon customer requests
Soft and highly compressible
Easy for die-cut