TG-A38KX - High Performance Thermal Pad

TG-A38KX – High Performance Thermal Pad

●Great thermal conductivity

●Difficult to be deformed

●Easy to assemble

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A38KX has great thermal conductivity, it’s difficult to be deformed and easy to assemble. With Protection, impact absorption, flame resistance, and good fit.

For overseas orders, please send in enquiry form.

Application

【Suitable for low-power products 】

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.

This high-performance thermal pad has a very good gap-filling ability, good temperature resistance, and it can work firmly at -40°C~200°C. The material has high electrical insulation and self-adhesiveness, and no additional adhesive is required to delay heat conduction. Widely used in industry, electronics, automotive components, Power supply and other industries, high thermal conductivity, and low cost.

TG-A38KX – High Performance Thermal Pad

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TG-A38KX – High Performance Thermal Pad

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