High Performance Thermal Pad TG-A38KF

●Great thermal conductivity

●Difficult to be deformed

●Easy to assemble

●Fiberglass on one side

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TG-A38KF is a soft gap filling material, glass fiber thermal conductive silicon film with thermal conductivity of 3.3W/MK. This material has excellent thermal performance under low pressure. One mask is self-adhesive. On the other hand, because of its glass fiber characteristics, it can effectively increase the withstand voltage strength, and it is resistant to shear and tear, not easy to deform, and it has good thermal conductivity.

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Application

【Suitable for low-power products 】

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.

TG-A38K is formulated with unique 3.8W/MK thermal conductivity. It also has excellent thermal conductivity under elevated pressure. In addition, this material has excellent self-adhesiveness, even if it encounters high roughness, and it can also show its high-performance bonding effect. Ideal for high-performance applications that require low assembly stress. This product is mostly used in applications such as the telecommunications industry, ASIC and DSP, consumer electronic products, and cooling modules.

High Performance Thermal Pad TG-A38KF

Application

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