TG-A4500F – Ultra Soft Thermal Pad

●Very good thermal conductivity
●Fiberglass on one side
●Non deforming
●Electeical insulation

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
TG-A4500F thermal pad with 4W/MK thermal conductivity and fiberglass mesh are attached to the surface. It has the characteristics of high flexible strength, low friction, low elongation, and non-deformation. It has excellent voltage resistance and the high-end thermal conductivity of the TG-A fiberglass Mesh Thermal Pad Series. Its performance is between TG-A3500F and TG-A6200F.