
`<?php echo do_shortcode(' '); ?>`

0 items / $0.00

Click to enlarge

Back to products

TG-A3500F – Ultra Soft Thermal Pad

●Very good thermal conductivity
●Fiberglass on one side
●Non deforming
●Electeical insulation

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

For overseas orders, please send in enquiry form.

SKU: TG-A3500F Categories: All Products, Catalogue, Thermal Interface, Thermal Pad/Gap Filler

Application

Application

Fiberglass on one side, best for high power applications

Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.