TG4040 – Thermal Putty

TG4040 is a thermal putty and a gap filler between solid and liquid with excellent thermal conductivity of 3.2W/mK, low thermal resistance, and excellent long-term reliability.

Only a small amount of TG putty is needed to fill the uneven gaps. This improves the flexible processability of the manufacturing end, is thinner, does not overflow, and does not harden, which is very suitable for components that do not require high-strength mechanical structural bonding, and provides better thermal conductivity.