TG-NSP25 – Thermal Putty

Features

• Electronic components: Electric Vehicles, 5G, Autopilot System, Mobile Phone, AIOT, HPC (High Performance Computing),Server, IC, CPU, MOS, LED, Mother Board,Power Supply,Heat Sink,LCD-TV,Notebook,PC,Telecom Device,Wireless Hub,DDR ll Module, etc.TG-NSP25 This product is a silicone-free thermal conductive paste and the color of this product is grey. The advantage of this product is that there is no thermal gel containing silicone oil. It can be shaped and pressed arbitrarily, and Low thermal resistance, working temperature can reach up to 150 degrees high temperature, its material is motor body, without the trouble of liquid flow phenomenon, it is very suitable for the material applied on the IC north bridge.