TG-A20KF – Thermal Pad

●Great thermal conductivity

●Difficult to be deformed

●Easy to assemble

●Fiberglass on one side

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TG-A20KF is a glass fiber thermal conductive silicone material with1.8W/MK thermal conductivity. At the same time, it has self-adhesive, glass fiber features, is puncture-resistant, and is not easy to deform. Normal operation at -40 to +180 degrees C, not only safe but also for applications that need to provide heat sinks for the device and high-voltage equipment, it can also produce great heat conduction benefits, providing excellent heat conduction and insulation performance.