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Thermal Compound

Good thermal conductivity from 0.8W/mk
Weight loss <0.5%
Specific Gravity 2.3g/cm³
Working temperature -40 to +180℃
Volume resistance 1012 Ohm-cm
Standard Package 1 Kg / pot
Easy to apply
High stability for thermal transfer.
Application Electronics component: IC, CPU GPU chipset

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Categories: All Products, Catalogue, Thermal Compound, Thermal Interface

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