TG-A38KF – High Performance Thermal Pad

●Great thermal conductivity

●Difficult to be deformed

●Easy to assemble

●Fiberglass on one side

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TG-A38KF is a soft gap filling material, glass fiber thermal conductive silicon film with thermal conductivity of 3.3W/MK. This material has excellent thermal performance under low pressure. One mask is self-adhesive. On the other hand, because of its glass fiber characteristics, it can effectively increase the withstand voltage strength, and it is resistant to shear and tear, not easy to deform, and it has good thermal conductivity.