TG-A1660 - Ultra Soft Thermal Pad

TG-A1660 – Ultra Soft Thermal Pad

Thermal Conductivity: 16.6

By using a special process, we use the silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

For overseas orders, please send in enquiry form.

Description

TG-A1660 thermal pad has a high thermal conductivity 16.6W/MK, the flexible characteristics of soft materials can be attached to uneven surfaces, which fully conducts the heat source to the metal shell or diffuser plate to improve the efficiency and service life of the heating electronic components.

Features

Thickness
Thermal Conductivity
Hardness : 30-60 Shore 00, Soft and highly compressibility
Low contact thermal impedance
Silicon and non-silicon base material
UL V0 rated
Optional fiber glass reinforcement layer for better handling during assembly process
Natural tack on surfaces or laminate with adhesive tape upon customer requests
Soft and highly compressible
Easy for die-cut

TG-A1660 – Ultra Soft Thermal Pad

Description

Features

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RF Shielding Film

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Conductive Foam

TG-A1660 – Ultra Soft Thermal Pad

Description

Features

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