Thermal Compound
- Good thermal conductivity from 0.8W/mk
- Weight loss <0.5%
- Specific Gravity 2.3g/cm³
- Working temperature -40 to +180℃
- Volume resistance 1012 Ohm-cm
- Standard Package 1 Kg / pot
- Easy to apply
- High stability for thermal transfer.
- Application Electronics component: IC, CPU GPU chipset
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Categories: All Products, Catalogue, Thermal Compound, Thermal Interface